Barmak Paper Featured on Cover of Journal of Applied Physics

A recent paper from Prof. Katayun Barmak, the Philips Electronics Professor of Applied Physics and Applied Mathematics, and colleagues is featured on the cover page as a featured article for the October issue of the Journal of Applied Physics.

Ryan R. Gusley (1), Quintin Cumston (2), Kevin R. Coffey (2), Alan C. West (1), and Katayun Barmak (3), "Electrodeposition of Cu(111) onto a Ru(0001) seed layer for epitaxial Cu interconnects," Journal of Applied Physics 130, 135301 (2021); https://doi.org/10.1063/5.0063418

(1) Department of Chemical Engineering, Columbia University, New York, New York 10027, USA
(2) Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32816, USA
(3) Department of Applied Physics and Applied Mathematics, Columbia University, New York, New York 10027, USA